2024 Sputtering target with backing plate

Sputtering target with backing plate

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August undefined, 2024

WebSnS2 sputter target, 99.9%, 3 Dx 0.125 thick, bonded to AJA style BP, cracks. Material: SnS2 Tin Sulfide. Surplus Sputtering Target. Backing Plate: AJA raised PowerRing backing plate. Warranty: The target is fully warrantied for useability, even though it has cracks. They appeared after bonding, so we know the target is on the backing plate ... Web7 rows · The sputtering target and integrated backing plate are manufactured with the same material ...

Tunnel-type sputtering film-plating machine - Eureka wisdom …

Web27 Jan 2012 · Ion bombardment is a high energy collisional process that can heat target materials to their melting points unless cooled; hence most sputter targets are bonded to a water cooled backing plate. Backing plates are made normally made from copper and are mounted to a water cooling manifold. Other metallic backing materials are also used. WebSputtering targets can be categorized based on the types of bonding between the target material and the backing plate. Diffusion-bonded, solder-bonded and elastomer-bonded … prayer to love your neighbor

Sputtering Target Bonding Preferred Method - KAMIS Incorporated

WebArcing in current on deposition rate for non-sustained at plasma (?) magnetron sputtering. low pressure For same power P=I×V=constant, high current (ion number) comes with low voltage (ion 51 energy) Step coverage of sputtering Sputtering targets are generally large and provide a wide range of arrival angles in contrast to a point source. Step coverage is … WebThe substrates were placed on the rotary stage 10 cm below the metal target. Ag, Au, and Cu targets with a diameter of 57 mm and purity of 99.99% were used as targets. The process was performed at the pressure of 2 mbar with the application of argon plasma. Thin nanofilms (100 nm) were deposited on glass plates of 1.0 cm × 1.0 cm. http://www.bushorchimp.com/pz633654e-cz595be73-low-vapor-pressure-niobium-alloy-sheet-for-sputtering-target-astm-b392-98.html prayer to love our enemies

US20240282859A1 - Sputtering target-backing plate assembly an…

Sputtering targets - KDF

WebAs a ceramic material, tungsten carbide requires high temperatures of 1,900 to 2,200°C for compression. We therefore produce our targets using hot presses and thereby achieve at least 99% of the theoretical density. As a result, no powder particles are released from the target during sputtering and the coating adheres perfectly. WebWe supply round and custom sputter targets, fabricate backing plates and provide target bonding service at a very nominal cost. Wide variety of materials ready to ship. High purity Metal pellets, Metal oxide, Magnesium Fluoride, Zinc sulfide pieces and granules; 2in to 8in round sputter targets with high density and purity sc office 2003WebBACKING PLATES. Planar Plasmaterials, Inc., manufactures a complete line of backing plates for almost every commercially available sputtering, cathodic arc, ion deposition … prayer to lord murugan

"WebSilicon (Si) Sputtering Targets Overview. Our comprehensive offering of sputtering targets, evaporation sources and other deposition materials is listed by material throughout the … " - Sputtering target with backing plate

Sputtering target with backing plate

Bonding for Sputtering and Backing Plates Plasmaterials

WebNiobium Target. Specification: ASTM B 393 RO4210. State: annealed or unannealed. Shape: round or square target per you request. circular targets: Diameter 25-400mm x Thickness 3- 28mm. rectangular targets: Thickness 1-12.7mm x … Web13 Apr 2024 · April 13, 2024. Advanced materials innovator Indium Corporation is pleased to announce that the company has joined the European Center for Power Electronics (ECPE), the leading industrial and research network for power electronics in Europe. Through its involvement with the organization, Indium Corporation continues to position itself as a ...

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WebOur targets are available in standard diameters from 1” to 14” (10 mm to 356 mm) and standard tiles up to 5” wide x 11” long (125 mm x 300 mm) in size. Each target can also be bonded with In/Sn or Ag epoxy to the backing plates or cups your application requires. Contact Our Experts +1 317 240 2500 Hours: 8:00 am - 4:00 pm (EST) http://www.sputteringtargets.co.uk/bonding-backing-plates.htm

Web20 Jun 2024 · In this work, we coated SrTiO 3 nanolayer on alkali-heat treated titanium (AH-Ti) by magnetron sputtering and different durations of magnetron sputtering were performed to select the best duration of magnetron sputtering. We hypothesize that strontium nanolayer can combine with the micro structure of AH-Ti to form … Web−Target material sintered, hot-pressed (gaseous), powder (contamination), liquid, high purity film from very dense targets; solder bonds > epoxy bonds −Pre-sputtering of Targets for cleaning (surface oxide) and reaching equilibrium (thermal equilibrium, out gassed, altered layer — for compound target) − Sputter Etching of Substrates Gross surface …

WebTiO2 Target, Diameter: 2 Inch / 3 Inch / as required, Thickness 2 mm / 3 mm / as required, Purity 99.99% / as required, with or without Copper backing plate WebHigh purity sputtering targets are available in a variety of geometries, including planar, circular, conical, rectangular, ring, delta and custom configurations. KDF incorporates material processing techniques that include: Vacuum induction melting Vacuum/ inert hot pressing Hot/cold isostatic pressing Electron beam melting

WebSputtering target backing plate cleaning and resurfacing for superior adhesion ; 100% target-backing plate alignment for proper fit of the cathode ; Sputtering target stocking …

Webcorrect Mr. Paul Lippens has suggested, the oxide targets should be well bonded to a copper backing plate when used in rf sputtering systems. Avoid using very high powers. I would say on a... prayer to lose weightWebPlasmaterials, Inc. sputtering target bonding process provides all metal bonding to affix sputtering targets to backing plates for systems which do not utilize a bolt-on target … prayer to lord vishnuWebBuy Tellurium 99.999% pure Sputtering Target, 2 inch x 4mm, bonded to Cu, ACI Alloys in San Jose, California, United States, for US $2300. Here we have a tellurium 99.999% pure sputtering target: * Dimensions 2 inch diameter x 4mm thick. * It comes bonded to a 2mm copper backing plate. *Please see the photo, which shows some surface porosity. scoff hamiltonWebAu Target, Diameter: 2 Inch / 3 Inch / as required, Thickness 1 mm / 2 mm / as required, Purity 99.99% / as required, with or without Copper backing plate prayer to lord jesusWebKDF utilizes a variety of sputtering techniques to bond targets to various backing plates. Indium and indium alloys are used to develop a high strength bond and insure the thermal transfer and conduction needed for today’s high powered sputtering systems. prayer to love othersWeb8 May 2024 · Most sputtering targets are bonded to copper backing plates or copper sheet, as this material offers enhanced thermal conductivity. Kamis also offers other sputtering target backing plate options including stainless steel, molybdenum and aluminum. sc office of child supportWeb11 Dec 2024 · sputtering target backing plate. High-purity metal sputtering targets are important sputtering coating raw materials in the manufacture of electronic products. … sc office highway safety